Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service (https://www.faraday-tech.com/en/content/Product/ASIC_Service/AdvancedPackageSolution). With an unique interposer manufacturing service for chiplets connection and close collaboration with top-tier foundry and OSAT suppliers to secure capacity, yield, quality, reliability, and schedule in production, Faraday assures seamless integration of...